|
Standard |
Advanced |
Emerging |
| Panel Size |
18″ X 24″ & 19″ X 25″ |
21″ X 24″ & 24″ X 30″ |
21″ X 24″ & 24″ X 30″ |
| Layer Count |
2 to 36 |
48+ |
60+ |
| Laminate Materials |
|
|
|
| FR4 Tg 140 |
Yes |
Yes |
Yes |
| FR4 Tg 170 |
Yes |
Yes |
Yes |
| GETEK |
Yes |
Yes |
Yes |
| Rogers |
Yes |
Yes |
Yes |
| Polyimide |
Yes |
Yes |
Yes |
| Duroid |
Yes |
Yes |
Yes |
| RoHs Materials |
Yes |
Yes |
Yes |
| Polyclad 370 HR |
Yes |
Yes |
Yes |
| Isola 410 |
Yes |
Yes |
Yes |
| TUC |
Yes |
Yes |
Yes |
| Halogen Free |
Yes |
Yes |
Yes |
| Stablcor |
Yes |
Yes |
Yes |
| Exotic Material Types |
Yes |
35+ |
40+ |
| Finished Thickness [Multilayer] |
.005″ to .220″ |
.220″-.250″ |
Greater than .250″ |
| Minimum Core Thickness |
.002″ |
.002″ |
.001″ |
| Finished Thickness Tolerance [+/-] |
10% |
7% |
5% |
| Multiple Laminations |
5 |
9 |
12+ |
| Copper Foil Weights Internal |
1/4 to 2 |
Up to 6 ounce |
Up to 6 ounce |
| Copper Foil Weights External |
1/4 to 3 |
Up to 4 ounce |
Greater than 6 ounce |
| Lines, Spaces, & Pad Diameters |
|
|
|
| Internal Line Width |
.0035″ |
.002” |
Less than .002″ |
| Internal Spacing |
.0035″ |
.002″ |
Less than .002″ |
| External Line Width |
.0035″ |
.002″ |
Less than .002″ |
| External Spacing |
.0035″ |
.002″ |
Less than .002″ |
| Int. Pad Size-A/R Per Side (Fin.-.001) |
.005″ |
.004″ |
Less than .004″ |
| Ext. Pad Size-A/R Per Side (Fin.-.002) |
.003″ |
.003″ |
Less than .003″ |
| SMT Pitch |
.010″ |
.010″ |
Less than .010″ |
| Impedance |
10% |
5% |
Greater than 5% |
| Electroplating |
|
|
|
| Tin Lead Plating Thickness |
.0003″-.0005″ |
Greater than .0005″ |
Greater than .0005″ |
| Tin Nickel Plating Thickness |
150Microinches |
250 Microinches |
Greater than 250 Microinches |
| Low Stress Nickel |
100 Microinches |
250 Microinches |
Greater than 250 Microinches |
| Gold Plating Thickness |
30 Microinches |
As Specified |
As Specified |
| Minimum Drilled Hole Size |
0.012 |
.0098″ |
Less than .0059″ |
| Hole Aspect Ratio |
10 to 1 |
15 to 1 |
Less than 20 to 1 |
| Conductor Finishes |
|
|
|
| HASL |
Yes |
Yes |
Yes |
| Solder with Reflow |
Yes |
Yes |
Yes |
| White Tin |
Yes |
Yes |
Yes |
| Carbon Ink |
Yes |
Yes |
Yes |
| Lead Free Finishes |
|
|
|
| Electroless Nickel/Paladium/Gold |
Yes |
Yes |
Yes |
| Electroless Nickel/Immersion Gold |
Yes |
Yes |
Yes |
| Immersion Silver |
Yes |
Yes |
Yes |
| Entek Plus HT |
Yes |
Yes |
Yes |
| HASL |
Yes |
Yes |
Yes |
| Tolerances |
|
|
|
| Drilled Hole To Copper |
.008″ |
.007″ |
.006″ |
| Non Plated Hole Tolerances [+/-] |
.001″ |
.001″ |
Less than .001″ |
| Fabrication Tolerances [+/-] |
.005″ |
.003″ |
Less than .003″ |
| Via Capabilities |
|
|
|
| Laser Micro Vias |
.004″ |
.002″ |
Less than .002″ |
| Blind/Buried Vias |
.004″ |
.002″ |
Less than .002″ |
| Via Under PAD |
Yes |
Yes |
Yes |
| Back Drill |
Yes |
Yes |
.008″ larger than Primary Drill |
| Back drill Antipad |
Yes |
Yes |
.020″ larger than Primary Drill |
| Castellation |
Yes |
Yes |
Yes |
| Laser Drill |
.004 |
.002 |
Less than .002 |
| Mechanical Vias |
.0059 |
.0047 |
Less than .0047 |
| Tented LPI |
Coated With LPI |
Coated/plugged |
Coated/plugged |
| Plugged UV Curable [no solvent] |
Maximum .020″ |
Yes |
Yes |
| Silver Conductive Via Fill |
Yes |
Yes |
Yes |
| Non-Conductive ViaFill |
Yes |
Yes |
Yes |
| Soldermask and Legend |
|
|
|
| Minimum Mask Clearance [LPI] |
.003″ |
.002″ |
Less than .002″ |
| Minimum Soldermask Thickness |
0.0004″ |
0.0004″ |
0.0004″ |
| Gasketed Chip Scale Packaging |
.002″ |
.001″ |
Less than .001″ |
| Soldermask Type |
LPI |
Dry Film |
As required |
| Soldermask Color |
Green |
Any Color |
Any Color |
| Soldermask Web Minimum |
.004″ |
.003″ |
Less than .003″ |
| Legend Color |
White |
Any Color |
Any Color |
| Legend Feature Size |
.008″ wide x .030″ high |
.006″ wide x .03″ high min |
LPI Legend .003″ x .02″ |
| Flatness (Symmetrical construction) |
IPC Standard |
Review Required |
Review Required |
